TC4423A/TC4424A/TC4425A
16-Lead Plastic Small Outline (OE) – Wide, 7.50 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2 3
e
b
h
h
α
A
A2
φ
c
A1
Units
L
L1
MILLIMETERS
β
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
16
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A2
A1
E
E1
D
h
L
L1
φ
c
b
α
β
2.05
0.10
0.25
0.40
0.20
0.31
10.30 BSC
7.50 BSC
10.30 BSC
1.40 REF
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-102B
? 2007 Microchip Technology Inc.
DS21998B-page 15
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